EZReball Weights

There are times when semiconductor packages warp or they have so little mass compare to the EZRebal(TM) preform that they need to have extra force pushing down on the device. This custom made weight will be placed on top of the device and allow for there to be intimate contact between the balls of the preform and the pads on the device. Custom made based on package size inside of 3-5 days. Get more information visit www.soldertools.net Contact Us

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